PCB Surface Finish Compare
Nowadays, the normal surface finish of Printed circuit board (PCB)as follows:
1) OSP --- Organic Solderability Preservatives
2) Lead free HASL --- Hot Air Solder Leveling
3) Immersion gold --- Electroless Nickel immersion gold or...
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PCB Surface Finish Compare
Nowadays, the normal surface finish of Printed circuit board (PCB)as follows:
1) OSP --- Organic Solderability Preservatives
2) Lead free HASL --- Hot Air Solder Leveling
3) Immersion gold --- Electroless Nickel immersion gold or ENIG
4) Immersion Silver Ag
5) Immersion Tin Sn
In 2004 lead free HASL made large improve of equipment and material, thus lead free
HASL be the first method of PCB surface finish.
At the moment more than 80% PCB use HASL
to make the surface finish.
Advantage & Disadvantage for each PCB surface finish compare:
Surface finish Advantage Disadvantage
OSP
a) Good at solder is the benchmark
of solder.
b) It can recoat if the PCB past due
c)Very even, suit for SMT
d) Can make lead free solder
a)After open the packing have
to use off the PCB within
24hours.
b)When manufacture have to
put the antistatic gloves.
c)IR Reflow the peak
temperature is 220℃, for lead
free tin cream the peak
temperature is 240℃
d)Can not use ICT test, as it
wil
Less
